Workshop - Sustainable Electronics & International Cooperation on Semiconductors

Workshop – Sustainable Electronics & International Cooperation on Semiconductors

Detailed programme

Session 1 – European Innovation council

Grenoble – France | April 26, 2023

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Francis BALESTRA – CNRS Research Director at IMEP-LAHC, Director of the European SiNANO Institute
Workshop introduction
Eric-Olivier PALLU – Policy Adviser in the “EIC Board, Strategy and Feedback to Policy” Unit at the European Innovation Council (EIC) and SME Executive Agency of the European Commission
EIC Presentation
Isabel OBIETA – EIC Programme Manager for Responsible Electronics
EIC Responsible Electronics programme
Charlotte RIX NICOLAJSEN – Head of Bureau Europe - Auvergne Rhône-Alpes Entreprises
How to get help on your way to the EIC Accelerator
Hani Sherry, TiHive CEO
EIC Testimonial
Gilles Hamou,CEO and Co-founder
UPMEM presentation
Eric Mottin, Program manager, Aledia
Aledia presentation

Session 2 – Chips Acts

Grenoble – France | April 26, 2023

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Marco CECCARELLI – European Commission/DG Connect
EU Chips Act
Paolo A. GARGINI – IEEE Life-Fellow, JSAP Fellow and Chairman IRDS
Chips Acts and IRDS building pillars and bridges over valleys of death

Session 3 – Sustainable Electronics

Grenoble – France | April 26, 2023

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Leo T KENNY – IRDS ESH/S IFT Chair and Research Professor at the Center for High Technology Materials at the University of New Mexico
The IRDS Environmental, Safety, Health and Sustainability (ESHS) Roadmap initiative update
Stéphane MONFRAY – Senior Principal Engineer, Disruptive Technologies Expert / Technology Development Platform at STMicroelectronics Crolles
What future for the semiconductor industry in the age of climate change?
Evolution and diversification of semiconductor technologies
Mathilde BILLAUD – Research Fellow, Fraunhofer IZM.
Key IC data for an accurate life cycle assessment of ICT devices
Cédric ROLIN – Manager for the Sustainable Semiconductor Technologies and Systems (SSTS) Program, imec
Assessing the environmental impact of integrated circuit chip manufacturing
Thomas ERNST – Scientific Director, CEA-Leti
Sustainable ICT assessment, adoption and strategy
Thibault PIRSON – PhD researcher in the Electronic Circuits and Systems (ICTEAM/ECS) group at UCLouvain, Belgium
Can we cope with the massive production of integrated circuits (ICs)
within environmental limits?
Patrick PYPE – Director of Strategic Partnerships, NXP Semiconductors
How innovation leads to a better, safer, more secure and sustainable world?
Attila GÉCZY – associate professor, Budapest University of Technology and Economics (BME-VIK)
Sustainable printed circuits: a possible path to greener electronics
Dmitri PETROVYKH – Corporate Expert, International Iberian Nanotechnology Laboratory (INL)
Building Safe-and-Sustainable-by-Design Community in Electronics

Session 4 – Advanced Functionalities

Grenoble – France | April 27, 2023

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Enrico SANGIORGI – Director Emeritus SiNANO Institute – IRDS More than Moore Team leader
The More than More domain in the IRDS: white paper & future perspectives
Matthias ILLING – Program Manager Collaborative R&D, Bosch
Innovation in MEMS for the IoT and our digital life
Dr. Cosmin ROMAN – Senior Assistant at ETH Zürich
Low power transducers for the IoT
Alan O’RIORDAN – Senior Research Fellow Tyndall
Sensors for Agriculture & the Environment
Dr. Markus PFEFFER – Senior Manager Quality and Process Control / Funded R&D at Fraunhofer Institute for Integrated Systems and Device Technology IISB
SiC VDMOS Technology evolution as an example for sustainable and efficient energy conversion
Mikael ÖSTLING – Professor, solid state electronics, KTH Royal Institute of Technology (Sweden)
Wide Bandgap Power Devices for a Sustainable Future

Session 5 – Beyond CMOS

Grenoble – France | April 27, 2023

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Konrad SEIDEL – Manager of the “Emerging Memories” group, Fraunhofer IPMS, Center Nanoelectronic Technologies
Ferroelectric memories – Enabler for novel computing architectures
Jouni AHOPELTO – Chair of Nanoelectronics, VTT Technical Research Centre of Finland
On and Beyond CMOS
Qing-Tai Zhao – Forschungzentrum Jülich
Gate all around nanowire FETs: Operation from RT to Cryogenic temperatures
Andreas HEMMETTER – Ph. D, AMO/ RWTH Aachen University
Flexible Electronics with 2D Materials

Session 6 – Quantum Information Processing

Grenoble – France | April 27, 2023

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Dr. Scott HOLMES – IRDS Cryogenic Electronic and Quantum Information Processing Team leader
IRDS technology roadmaps for Cryogenic Electronics and Quantum Information Processing (CEQIP)
Maud VINET – Physicist, Co-founder of Siquance
The path to large scale quantum computing based on CMOS technology

Session 7 – Japanese session

Grenoble – France | April 28, 2023

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Hisashi KANAZASHI, Director of IT Industry Division, Commerce and Information Policy Bureau, Ministry of Economy, Trade and Industry
Japan’s Semiconductor Strategy
Francis BALESTRA, ICOS coordinator
Current collaborations between ICOS partners and Japan
Carlo REITA, Director of Strategic Partnerships and Planning in the CTO Office, CEA-Leti
The EU Test and Experimentation Facility for Hardware Edge AI, PREVAIL, as a platform for development of new solutions
Matthias ILLING, Program Manager Collaborative R&D BOSCH
Trends in semiconductors for mobility
Colette MALONEY, Head of Unit, DG Connect
EU-Japan Digital Partnership on Semiconductors

Session 8 – Advanced Computing

Grenoble – France | April 28, 2023

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Mustafa Badaroglu – IRDS More Moore Team leader
IRDS More Moore Roadmap for edge and cloud computing
Roberto Gonella – STMicroelectronics
Augmented FDSOI platforms for improved sustainability
Anabela Veloso – imec
Nanosheet-based Device Architectures for Enabling Advanced CMOS Logic Scaling
Sébastien Loubriat – SOITEC
FDSOI engineered substrates for advanced computing

Session 9 – Semiconductors–based Photonics

Grenoble – France | April 28, 2023

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Abdul Rahim – EpiXFab
Silicon Photonics__Current state, trends, and future evolution
Stephan Suckow – AMO GmbH
Neuromorphic Computing – At the intersection between Electronics and Photonics
Frédéric Bœuf – STMicroelectronics
Silicon photonics and applications

Project details:

TITLE: International Cooperation On Semiconductors START-END: January 2023 – December2025
EU CONTRIBUTION: 2, 99M€
TOPIC: HORIZON-CL4-2022-DIGITAL-EMERGING-01

Contact:

Coordinator: Francis Balestra

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ICOS has received funding (2023 – 2025) from the European Union’s Horizon Europe research and innovation programme under GA No 101092562.