Introduction

SESSION 1- Advanced Functionalities

  • Semiconductor photnics: silicon and more - Emiel Dieussaert (Ghent University / imec)

  • Photonics and Semicodnuctor Convergence; VCSELs, GaN and Beyond - Anna Szerling, Weronika Glowadzka (Lukasiewicz)

SESSION 2: Advanced Functionalities

 

  • Singapore Hybrid-Integrated Next Generation µ-Ekectronics (SHINE) Centre - Prof Aaron Thean (NUS)

  • Atomically thin, exceptionally powerful! 2D materials in More-than-Moore electronics - Francisco Gamiz (University of Granada)

SESSION 3 – Heterogeneous Integration & Advanced Packaging

  • Functional Diversification via Heterogeneous Integration Methods and overview of NCAIP/WISDOM - Tan Chuan Seng (NTU)

  • Integration of Chiplets in a 3DIC R&D Foundry - Emmanuel Ollier (CEA-Leti)

  • Advanced packaging and heterogeneous integration via fanout, 2. 5D interposer and 3D stacking - Navab Singh (A*Star)