2025 International Semiconductor Researchers Forum - Presentations

Detailed programme

Policy Session

Welcome Remarks - Chang Yune Lee - MSIT, Korea
Congratulatory Speech - Rainer Wessely (EU Del. to RoK)
Korea’s International R&D Cooperation - Sang Wan Ryu (NRF)
(PART 1-1. Sang Wan Ryu) Korea’s International Semiconductor R&D Cooperation
Horizon Europe - Juyoung Kim (EU Del. to RoK)
(PART 1-2. Ju young Kim) Horizon Europe
The Chips Joint Undertaking and its role in the European semiconductor ecosystem - Jari Kinaret (Chips JU)
(PART 1-3. Jari Kinaret) The Chips Joint Undertaking and its role in the European semiconductor ecosystem
KE-SRCC Introduction - Seo Gyun Kim (KE-SRCC)
(PART 1-4. Seo Gyun Kim) KE-SRCC Introduction

Part 2 (ROK-EU), Chair: Francis Balestra

Current Progress in the Development of FeRAM-Based AI Accelerators - Dae Woong Kwon (Hanyang University)
Silicon compatible Hafnia-based ferroelectrics for neuromorphic computing technologie - Athanatos Dimoulas
Download the presentation here
Neuromorphic Computing Systems for Heterogeously-Intergrated Silicon Photonics LiDAR - Jong Hyeok Yoon (DGIST)
Neuromorphic Enhanced Heterogeneously Integrated FMCW LiDAR - Ruud Oldenbeuving (imec, NL)
(PART 2-4. Ruud Oldenbeuving) Neuromorphic Enhanced Heterogeneously Integrated FMCW LiDAR
EU-ROK collaborative project to enable energy efficient neuromorphic two-dimensional devices for edge computing - Dmitry Chigrin (AMO, DE)
(PART 2-6. Dmitry Chigrin) EU-ROK-chigrin_ENERGIZE
Development of AI Accelerators Leveraging Silicon Photnics Technology - Sang Yoon Han (DGIST)
(PART 2-7. Sang Yoon Han)Development of AI Accelerators Leveraging Silicon Photonics Technology

Part 3 (ROK-EU)

Pathfindings R&D to enable the transition form lab-to-fab - Inge Asselberghs (IMEC, BE)
(PART 3-1. Inge Asselberghs)Pathfinding R&D to enable the transition from lab–to–fab
2D Semiconductor-Based Nanoelectronics: Advances in Materials, Processing, and Computing - Joon Ki Suh (UNIST)
(PART 3-2. Joon Ki Suh)2D Semiconductor-Based Nanoelectronics Advances in Materials, Processing, and Computing
Power Device - Markus Pfeffer (Fraunhofer, DE)
(PART 3-3. Markus Pfeffe)Power Device
Sub-100 nm GaN HEMTs for W-band power amplifier applications and beyond - Dae Hyun Kim (Kyungpook Nat ’ Univ.)
(PART 3-4. Dae Hyun Kim)Sub-100 nm GaN HEMTs for W-band power amplifiier applications and beyond
Heterogeneous integration for silicon photonics with micro-transfer printing - Emiel Dieussaert (UGENT, BE)
(PART 3-5. Emiel Dieussaert )Heterogeneous integration for silicon photonics with micro-transfer printing
Semiconductor epitaxy without chemical bonds on wafers for 3-dimensional vertical hetero-integration - Young Jun Hong (Sungkyunkwan Univ.)
(PART 3-6. Young Joon Hong)Semiconductor epitaxy without chemical bonds on wafers for 3-dimensional vertical hetero-integration
Horizon Europe ICOS (International Cooperation on Semiconductors) - Francis Balestra (SiNANO Institute/ GINP/CNRS)
(PART 3-7. Francis Balestra)Horizon Europe ICOS

Project details:

TITLE: International Cooperation On Semiconductors START-END: January 2023 – December2025
EU CONTRIBUTION: 2, 99M€
TOPIC: HORIZON-CL4-2022-DIGITAL-EMERGING-01

Contact:

Coordinator: Francis Balestra

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ICOS has received funding (2023 – 2025) from the European Union’s Horizon Europe research and innovation programme under GA No 101092562.

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