13:45 – 14:00
Bio
Francis Balestra, CNRS Research Director at CROMA, is Director Emeritus of the European SINANO Institute and President of IEEE Electron Device Society France, and has been Director of several Research labs. He coordinated several European Projects (NEREID, NANOFUNCTION, NANOSIL, etc.) that have represented unprecedented collaborations in Europe in the field of Nanoelectronics, and is currently coordinator of the Horizon Europe ICOS project dedicated to International Cooperation on Semiconductors with leading semiconductor countries.
He founded and organized many international Conferences, and has co-authored more than 500 publications.
He is member of several European Scientific Councils, of the Advisory Committees of International Journals and of the IRDS (International Roadmap for Devices and Systems) International Roadmap Committee, as representative of Europe.
Abstract
The main objectives and outcomes of the Horizon Europe project ICOS dedicated to International Cooperation on Semiconductors will be presented. International cooperation is key for speeding up technological innovation, reducing cost by avoiding duplicated research, boosting the resilience of the semiconductor value and supply chains, and is one of the objectives of the EU Chips Act. The main ICOS results dealing with the analysis of the semiconductor economic and technological landscapes in Europe and leading semiconductor countries, as well as the identification of areas of potential cooperation on advanced functionalities and computing will be highlighted.
14:00 – 17:00
Monika Curto Fuentes, Mediator
Monika Curto Fuentes studied International Law and International Relations at the Adam Mickiewicz University in Poznan, Poland and the University of Bielefeld, Germany. She has been working as a scientific advisor for mobility, energy and future technologies at VDI/VDE-IT since 2017. Ms. Curto Fuentes accompanies various European projects in the field of battery cell production (Batteries Europe, Battery IPCEI and Battery2030+) and semiconductors (ICOS), in which she is responsible for the international monitoring of battery and semiconductors ecosystems and the benchmarking of international KPIs.
Sven Bökemeier, Mediator
Sven Bökemeier completed his double degree with a focus on thin films in Science and Technology of New Materials at the University of Seville and Physics at the University of Münster. In 2023, he began his role as a scientific consultant at VDIVDE-IT in the field of microelectronics and high-performance computing, where he serves in addition to his work on the ICOS project as a consultant for the Federal Ministry of Education and Research and accompanies national and international projects in various parts of the semiconductor value chain.
Beth McEvoy, Mediator
Beth McEvoy is a strategic foresight practitioner, working at the intersection of anticipation studies and systems thinking. An expert in transdisciplinary research programmes, she is Research Co-Investigator on the UKRI Future of Semiconductor R&D project, the manager of the eFutures electronic systems network, and a named specialist on a major project that re-imagines the supply chains of tomorrow. In the city of Belfast, she currently works on the future of urbanity, sustainable placemaking, and tech for societal good.
Abstract
This session is co-organised with the project Future of UK Semiconductor R&D, funded as part of the UKRI grant and commissioned by DSIT.
International cooperation is a key objective of the ICOS project. By encouraging diverse perspectives, we can develop actionable strategies to achieve this goal.
The interactive workshop will engage participants in group discussions to identify main gaps in the European semiconductor value chain and explore solutions to turn risks into opportunities.
Through collaborative brainstorming and strategic foresight methodologies, we will focus on measures needed in critical areas such as advanced materials, packaging technologies, design methods, and AI-driven innovations.
Join us to contribute your insights and shape the future of Europe’s semiconductor industry!
17:30 – 19:00
Bio
Ryoishi Ishihara
Salahuddin Nur
Abstract
8:45 – 12:00
Giorgos Fagas, Tyndall National Institute
Giorgos Fagas PhD MBA is Head of CMOS++ and EU Programmes at Tyndall, and member of Tyndall’s Leadership Team. CMOS++ is a strategic programme addressing emerging materials, devices and architectures for next-generation information processing interfacing with CMOS and beyond. He is contributor to key international strategic R&I agendas incl. the ECS-SRIA and IRDS and has initiated several large-scale EU projects. He currently leads the EU-funded programmes for open access to infrastructure for early-stage research on nanoelectronics and semiconductor chips, respectively, ASCENT+ and INFRACHIP, and the ICOS project activity on Technology Scanning and Foresight. Giorgos holds prominent positions in various policy and industry groups including Director of the SiNANO Institute.
Danilo Demarchi, Politecnico di Torino
Danilo Demarchi: Full Professor at Politecnico di Torino, Leading the eLiONS Lab (electronic Life-Oriented iNtelligent Systems). Smart System Integration and IoTs for the AgriFood Value Chain and for BioMedical Devices. Pioneer in the research on Wearable Plant Sensors.
Visiting Professor at EPFL Lausanne (2019) and at Tel Aviv University (2018-2021). Visiting Scientist (2018) at MIT and Harvard Medical School. Founder and Editor in Chief of the IEEE Transactions on AgriFood Electronics. Founder and Chair of the IEEE CAS Special Interest Group on AgriFood Electronics. 2023-2024 Distinguished Lecturer for the IEEE CAS Society with the Lecture “Let the Plants Do the Talking: Smart Agriculture by the messages received from Plants and Soil”. Founder at Politecnico di Torino of the Master’s Degree in AgriTech Engineering.
Paolo Motto Ros, Politecnico di Torino
Paolo Motto Ros: Assistant Professor at Politecnico di Torino. Circuits and systems, and smart system integration, for wireless implantable and wearable biomedical devices and applications; electronics for agrifood.
Senior postdoc researcher at Istituto Italiano di Tecnologia (2014-2019) and Politecnico di Torino (2019-2022). Program co-chair of ApplePies 2024; member of the organizing committee of IEEE ICECS 2019, IEEE FoodCAS2021 (ISCAS2021), and IEEE CAFE 2023; RCM of IEEE BioCAS 2021-2024, organizer of a special session at IEEE MeMeA2021, PCM of IEEE LASCAS2022/2023; guest editor of MDPI Sensors and guest associate editor of Frontiers in Neurorobotics. Associate Editor of IEEE Transactions on Biomedical Circuits and Systems and IEEE Transactions on AgriFood Electronics.
Abstract
The session aims to have contributions form non-EU leading experts about the strengths and weaknesses of seven countries (Japan, South Korea, USA, Singapore, Taiwan, India, China) in the semiconductor value chain and propose recommendations for international research cooperation.
Bio
Hiroyuki Akinaga (Senior Member, IEE) received the B.E., M.E., and Ph.D. degrees from the University of Tsukuba, Ibaraki, Japan, in 1987, 1989, and 1992, respectively. Currently, he is the Principal Research Manager, Device Technology Research Institute, National Institute of Advanced Industrial Science and Technology (AIST). He is co-leader of the Beyond CMOS Working Group (WG) at International Roadmap for Devices and Systems (IRDS), Japanese leader of the research field of energy harvesting at More-than-Moore WG, and a strategic committee member at WG of Environment, Health, Safety and Sustainability (ESHS). He has been serving as a convenor at International Electrotechnical Commission (IEC), TC113 (Nanotechnology for electrotechnical products and systems), WG7 (Reliability) and WG13 (Wafer-Scale System Integration). He is a fellow of Japan Society of Applied Physics. His current interests include nanoelectronics and open innovation platform
Abstract
14:00 – 14:45
Bio
Mattias Verstuyft got his master thesis in theoretical physics at the University of Ghent in 2016, after which he did a PhD in silicon photonics at the Photonics Research Group in Ghent University under prof. Bart Kuyken. After managing several EU funded photonics projects with industrial and academic partners (through ActPhast and PhotonHub Europe), he started working as the technical coordinator of ePIXfab – the European silicon photonics alliance – where he handles day-to-day operations, coordinates trainings and other activities, and advocates on behalf of its members and the silicon photonics community at large.
Abstract
We will present an analysis of the most urgent challenges facing the European semiconductor field and identify opportunities for international cooperation with other regions. This analysis is based on a survey polling experts in the field as well as previous work done in ICOS. We will finish by requesting feedback and opinions on this analysis from the audience.
14:45 – 16:00
Bio
Krzysztof Mieszkowski is a researcher at the Centre for Advanced Materials and Technologies CEZAMAT at Warsaw University of Technology. He holds a master’s degree in finance and banking from the Warsaw School of Economics. He has almost 20 years of professional experience in the field of scientific research and development and higher education, including aspects of research and innovation policy. His portfolio of recent projects includes ERA_FABRIC, ICOS, Mazovia EDIH, INFRACHIP and FAMES. From 2012 to 2019, he worked at the European Commission’s Joint Research Centre in Seville. As a member of the Smart Specialisation team, he was involved in promoting and implementing the concept of smart specialisation. That time, he also dealt with the Key Enabling Technologies theme and in the activities of the Thematic Platform on Smart Specialisation for Industrial Modernisation. In 2005-2012 he worked at the Ministry of Science and Higher Education in the department responsible for the implementation of the Structural Funds and in the strategy department. He contributed to the analysis of science and higher education policy issues. He used to be a member of working groups of the European Commission and the OECD.
Abstract
16:30 – 17:45
Chair: Peter Ramm, Fraunhofer EMFT
Dr. Peter Ramm is head of Strategic Projects at Fraunhofer EMFT Munich, responsible for initiation and steering of strategic projects and international research co-operations. He received Masters and PhD degrees from the University of Regensburg and subsequently worked for Siemens in the DRAM facility where he was responsible for the overall process integration. In 1988, he joined Fraunhofer, focusing for more than 35 years on 3D integration technologies. Ramm developed and patented 3DIC approaches with particular focus on heterogenous integration. Peter Ramm is author of over 130 publications and 30 patent families. He received the “Ashman Award 2009” from IMAPS and the 2020 IEEE Technical Field Award “For Pioneering Contributions Leading to the Commercialization of 3D Wafer and Die level Stacking Packaging”.
Peter Ramm is Senior Member IEEE, IMAPS Fellow and Life Member.
Hiroyuki Akinaga, Hokkaido University
Hiroyuki Akinaga (Senior Member, IEEE) received the B.E., M.E., and Ph.D. degrees from the University of Tsukuba, Ibaraki, Japan, in 1987, 1989, and 1992, respectively. Currently, he is the Principal Research Manager, Device Technology Research Institute, National Institute of Advanced Industrial Science and Technology (AIST). He is co-leader of the Beyond CMOS Working Group (WG) at International Roadmap for Devices and Systems (IRDS), Japanese leader of the research field of energy harvesting at More-than-Moore WG, and a strategic committee member at WG of Environment, Health, Safety and Sustainability (ESHS). He has been serving as a convenor at International Electrotechnical Commission (IEC), TC113 (Nanotechnology for electrotechnical products and systems), WG7 (Reliability) and WG13 (Wafer-Scale System Integration). He is a fellow of Japan Society of Applied Physics. His current interests include nanoelectronics and open innovation platform
Mustafa Badaroglu, Qualcomm
Mustafa Badaroglu works at Qualcomm with focus on technology ramp and architecture enhancements of AI chipsets, ultra-low voltage process and design methods and stacked memory technologies. Before joining Qualcomm, he previously worked at Huawei, imec, ON Semiconductor, and Tubitak Space. During his career he had various assignments for the execution and management of mobile and automotive chipset design from concept to initial ramp, process technology pathfinding, and system technology co-optimization. He holds a PhD in electrical engineering from the Catholic University of Leuven in Belgium
Giorgos Fagas, Tyndall National Institute
Giorgos Fagas PhD MBA is Head of CMOS++ and EU Programmes at Tyndall, and member of Tyndall’s Leadership Team. CMOS++ is a strategic programme addressing emerging materials, devices and architectures for next-generation information processing interfacing with CMOS and beyond. He is contributor to key international strategic R&I agendas incl. the ECS-SRIA and IRDS and has initiated several large-scale EU projects. He currently leads the EU-funded programmes for open access to infrastructure for early-stage research on nanoelectronics and semiconductor chips, respectively, ASCENT+ and INFRACHIP, and the ICOS project activity on Technology Scanning and Foresight. Giorgos holds prominent positions in various policy and industry groups including Director of the SiNANO Institute.
Dominique Noguet, CEA-Leti /FAMES Pilot Line Coordinator
Dominique NOGUET holds an engineering degree in electrical engineering (1992) and a PhD in microelectronics (1998). He started his carrier as an IC designer. He led many projects at a national level and in several European frameworks. He has been a key member of several IEEE standard groups in the field of Cognitive Radio. In parallel, he held managerial positions at CEA-Leti as lab manager and department manager. In January 2023, he was appointed project manager for the ‘France 2030’ flagship project NextGen on FD-SOI advanced nodes, and is currently the project coordinator of the Chips Act’s FAMES Pilot Line.
Mikeal Osling, KTH
Mikael Östling received his MSc and the PhD degrees from Uppsala University, Sweden. He was deputy president of KTH between 2017-2022. His research interests are nanoscaled Si and Ge device technologies and emerging 2D materials, as well as device technology for wide bandgap semiconductors for high power/high temperature applications. He has supervised 47 PhD theses work and co-authored 500+ scientific papers published in international journals and conferences. Östling was an editor of the IEEE Electron Device Letters 2005-2014 and editor in chief of the IEEE J-EDS 2016-19. Östling is a Fellow of the IEEE.
N.N, ESMC
Toggle Content goes here
TITLE: International Cooperation On Semiconductors START-END: January 2023 – December2025
EU CONTRIBUTION: 2, 99M€
TOPIC: HORIZON-CL4-2022-DIGITAL-EMERGING-01
Coordinator: Francis Balestra
ICOS has received funding (2023 – 2025) from the European Union’s Horizon Europe research and innovation programme under GA No 101092562.